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清华大学电机系

清华大学电机系本科生

清华大学电机系研究生

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Current Location: Home > People > Faculty & Staff > Electric Power & Electronics and Motor System Research Institute > Teacher with Deputy Senior Title > Content

Ji Shiqi

Associate Professor, Department of Electrical Engineering, Tsinghua University

Research Interests

Power electronics in High power and high voltage power conversion, Wide bandgap power semiconductors, Power electronics in distribution grids

West Main Building, 3-325 Department of Electrical Engineering, Tsinghua University Beijing, 100084, P. R. China

chic2020@tsinghua.edu.cn

010-62790248

  • Biography
  • Teaching
  • Research Projects
  • Publications
  • Social Service

Shiqi Ji received the B.E. and Ph.D. degrees in electrical engineering all from Tsinghua University, Beijing, China, in 2010 and 2015, respectively. Since 2015, he joined as a Research Associate with the Center for Ultra-Wide-Area Resilient Electric Energy Transmission Networks (CURENT), the University of Tennessee, Knoxville, TN, USA, and became a Research Assistant Professor in 2019. From 2020, he joined as an Assistant Professor in Department of Electrical Engineering at Tsinghua University, Beijing, China, and became an Associate Professor in 2021. From Jul. 2013 to Nov. 2013, he was a Research Scholar at the Wisconsin Electric Machines and Power Electronics Consortium (WEMPEC), the University of Wisconsin-Madison, Madison, WI, USA. His main research interests are Power electronics in High power and high voltage power conversion, Wide bandgap power semiconductors, Power electronics in distribution grids.

He has led over 10 projects, including national talent programs, National Natural Science Foundation of China General Programs, and projects from industry, with a total funding exceeding 30 million RMB. He has developed a series of key technologies and equipment, such as high-bandwidth transient measurement equipment, high-voltage SiC gate drives, low-loss flexible commutation equipment, and active voltage balancing for series-connected devices. Additionally, he has developed a series of high-performance power conversion equipment, including high-voltage SiC based high-density PV inverter and megawatt-level SiC-based multi-port power electronic transformers.

He has received numerous awards, including the National Young Talent award, China Electric Power Outstanding Young Scientific and Technological Talent award, and Delta Young Scholar award. He has also been honored with first prizes in scientific and technological progress from the China Machinery Industry Federation and the Ministry of Education, the highest review award from the U.S. Power America program, and Gold Medal at the Geneva International Exhibition of Inventions in Switzerland. He has authored over 100 papers, including more than 30 SCI-indexed publications, and holds over 20 domestic and international patents. Additionally, he has received four international conference paper awards.

He teaches power electronics and power semiconductor courses in Tsinghua University, including one undergraduate course and one newly opened course. He leads one educational reform project and also conducts power electronics courses in English for international students. Furthermore, he has been awarded as an Outstanding Master's Thesis Advisor by Tsinghua University.

He served in several professional institutes. He was an IEEE senior member, and leadership committee member in IEEE PELS Beijing Section. He served as Associated Editor for IEEE TPEL, Engineering Reports, CJEE, etc. He was guest editors for IEEE JESTPE, CJEE, CPSS, etc. He served for some IEEE international conferences as committee members and session chairs including Local Chair for IEEE Wipda Asia, Session chair for IEEE ECCE, etc. 

Educational Background

2010-2015, Ph.D,Electrical Engineering, Tsinghua University, China

2006-2010, Bachelor of Eng., Electrical Engineering, Tsinghua University, China

Work Experience

Dec.2021-present, Associate Professor,Department of Electrical Engineering, Tsinghua University, Beijing, China

Dec.2020-Dec.2021, Assistant Professor,Department of Electrical Engineering, Tsinghua University, Beijing, China

Apr.2019–Feb.2020, Research Assistant Professor, Electrical Engineering & Computer Science, the University of Tennessee, Knoxville, TN, USA

Sep.2015–Apr.2019, Research Associate, Electrical Engineering & Computer Science, the University of Tennessee, Knoxville, TN, USA

Jul.2013–Nov.2013,Research Scholar,Electrical & Computer Engineering, the University of Wisconsin-Madison, Madison, WI, USA

Honors and Awards

2025, Delta Young Scholar

2023, First Prize for Scientific and Technological Progress, China Machinery Industry Federation

2023, Outstanding Young Scientific and Technological Talent in China's Electric Power Sector

2023, Invention and Entrepreneurship Award, China Association of Inventions

2022, First Prize for Scientific and Technological Progress, Ministry of Education

2021, Special Gold Medal with Congratulations of the Jury, Geneva International Exhibition of Inventions

2020, Best Paper Award, International Conference IEEE IPEMC

2020, National Young Talent

2019, Highest Review Award, U.S. Department of Energy Power America Program

2018, Best Presentation Award, International Conference IEEE APEC

2015, Second Prize for Outstanding Doctoral Dissertation, Tsinghua University

2015, Nominee for Tsinghua University Academic Rising Star

2011, Best Paper Award, International Conference IEEE ICEMS

Power Electronics (Undergraduates, 32 hrs)

Power Semiconductors (Undergraduates, 32 hrs)

2025-2026, AI-Based Modeling Analysis and Parameter Extraction Methods for Wide-Bandgap Power Semiconductors, Key Laboratory Project of Guangdong Province, China

2025-2026, Power Device Packaging Technology and Electromagnetic-Thermal Simulation-Assisted Development, China Southern Grid Technology Company, China

2026-2027, Low-Cost Magnetic Control Flexible Interconnection Technology for Distribution Networks, China Southern Grid Research Institute, China

2025-2027, High-Performance Magnetic Control Voltage Regulation Technology and Equipment, Beijing Electric Power Research Institute, China

2025-2026, Low-Cost Voltage Regulation Transformer for Flexible Distribution Networks, Shandong Electric Power Research Institute, China

2024-2026, Research and Demonstration Application of High-Reliability Magnetic Control Stepless Voltage Regulation Distribution Transformer Equipment, Guangdong Zhongpeng Electric Co., Ltd., China

2024-2026, Research on Topology and Control Technology for Magnetic Control Stepless Voltage Regulation Distribution Transformers, China Southern Grid Research Institute, China

2024-2026, Tsinghua University-China Southern Grid Technology Company Joint Research Center

2023-2026, Key Technologies for High-Voltage High-Power Turn-Off Device Driver Chips, National Key Research and Development Program, China

2023-2026, Decoupling control and power oscillation suppression for multi-port power electronic transformers, National Natural Science Foundation of China

2021-2022, MW-scale Multi-port Energy Router, Inovance Technology Co. Ltd, China

2021-2022, IGBT module reliability estimation, Shanghai Mitsubishi Elevator Company, China

2021-2022, 75 kW multi-function three-port power electronic transformer, Shandong Electric Power Research Institute, China

2020-2021, MW-scale Multi-function Multi-port Power Electronic Transformer, National Key R&D Program of China, China

2020-2023,SiC Based Modular Transformer-less MW-Scale Power Conditioning System and Control for Flexible Manufacturing Plants,Department of Energy, USA

2018-2021,SiC based modular transformer-less MW-scale power conditioning system and control for flexible CHP system,Department of Energy, USA

2017-2020,Multi-functional high-efficiency high-density medium voltage SiC based asynchronous microgrid power conditioning system module,Power America, USA

2014-2017, Agile direct grid connection medium voltage 4.7-12.47 kV power converter for PV applications utilizing advanced WBG devices,Department of Energy, USA

2016,Benchmark of Benefits of High Voltage SiC in Medium Voltage Power Distribution Grids,Oak Ridge National Laboratory, USA

2016-2017, Topology Evaluation of Aircraft Electric Power Distribution System, Safran Company, France


Selected Journal Paper:

1)M. Yang, Y. Xiao, S. Ji, W. Xie, Z. Zhao, C. Sheng, W. Yang, “Stray inductance extraction methods for power modules: a comprehensive review and analysis”, IEEE Trans. Power Electron., vol. 40, no. 2, pp. 8016-8035, Jan. 2025.

2)Y. Xiao, S. Ji, M. Yang, Z. Zhao, “An easy-to-implement flexible commutation design with reduced switching losses, di/dt and dv/dt for high-speed and high-power IGBTs,”IEEE Trans. Power Electron., vol. 40, no. 9, Sept. 2025.

3)H. Wang, S. Ji, D. Mou, W. Xie, Y. Zeng, Z. Zhao, “High-frequency-link-based reactive-power optimal control for modular multi-acitve bridge,”IEEE Journal of Emerging and Selected Topics in Industrial Electronics, vol. 5, no. 3, 2024.

4)H. Wang, Y. Zeng, S. Ji, Z. Zhao, L. Yuan, X. Mo, “ZVS soft switching operation region analysis of modular multi active bridge converter under single phase shift control,”IEEE Trans. Ind. Electron., vol. 70, no. 7, 2023.

5)J. Zheng, Y. Zeng, Z. Zhao, W. Liu, H. Xu, S.Ji, “A semi-implicit parallel leapfrog solver with half-step sampling technique for FPGA-based real-time HIL simulation of power converters,”IEEE Trans. Ind. Electron., vol. 71, no. 3, 2024.

6)R. Chen, F. Wang, L. Tolbert, X. Huang, D. Li, C. Nie, M. Lin, S. Ji, L. Zhang, “10kV SiC MOSFET based medium voltage power conditioning system for asynchronous microgrid,” IEEE Access, vol. 10, 2022.

7)J. Zheng, Z. Zhao, Y. Zeng, S. Ji, L. Yuan, “An event-driven parallel acceleration real-time simulation for power electronic systems without simulation distortion in circuit partitioning,” IEEE Trans. Power Electron., vol. 37, no. 12, 2022.

8)H. Wang, S. Ji, D. Mou, L. Yuan, Y. Zeng, Z. Zhao, “Switching characterization and power loss optimization for mofular multiactive bridge converter under common phase shift control,”IEEE Journal of Emerging and Selected Topics in Power Electronics, vol. 11, no. 4, 2023.

9)H. Wang, D. Mou, S. Ji, L. Yuan, Y. Zeng, J. Zheng, Z. Zhao, “Universal phase-shift modulation scheme and efficiency optimization for modular multiactive bridge converter,” IEEE Trans. Ind. Electron., vol. 71, no. 7, 2024.

10)Y. Zeng, J. Zheng, Z. Zhao, W. Liu, S. Ji, H. Li, “Real-time digital mapped method for sensorless multitimescale operation condition monitoring of power electronics systems,”IEEE Trans. Ind. Electron., vol. 71, no. 4, 2024.

11)H. Li, Z. Gao, F. Wang, Y. Ma, Y. Su, D. Li, P. Yao, S. Ji, Z. Yang, R. Chen, “Design, development, and testing of a flexible combined heat and power (F-CHP) system with 10kV SiC MOSFET-based power conditioning system (PCS) converter,” IEEE Access, vol. 11, 2023.

12)Y. Zeng, Z. Zhao, J. Zheng, H. Li, S. Ji, L. Yuan, “A self-restoring fault-tolerant method for controller cooperation simulation of power electronics systems,” IEEE Trans. Ind. Electron., vol. 71, no. 1, 2024.

13)H. Li, Z. Gao, S. Ji, Y. Ma, F. Wang, “An inrush current limiting method for grid-connected converters considering grid voltage disturbances,” IEEE Journal of Emerging and Selected Topics in Power Electronics, vol. 10, no. 2, pp. 2608-2618, Apr. 2022.

14)X. Huang, S. Ji, C. Nie, D. Li, M. Lin, L. Tolbert, F. Wang, W. Giewont, “Comprehensive analysis and improvement methods of noise immunity of desat protection for high voltage SiC MOSFETs with high dv/dt,” IEEE Open Journal of Power Electronics, vol. 3, pp. 36-50, Dec. 2021.

15)B. Shi, S. Ji, Z. Zhao, Z. Yu, “Discrete-State Event-Driven Numerical Prototyping of Megawatt Solid-State Transformers and AC/DC Hybrid Microgrids,” IEEE Access, vol. 9, pp. 108329-108339, Jul. 2021.

16)S. Ji, X. Huang, J. Palmer, F. Wang, L. Tolbert, “Modular multilevel converter (MMC) modeling considering submodule voltage sensor noise,” IEEE Trans. Power Electron., vol. 36, no. 2, pp. 1215-1219, Feb. 2021.

17)S. Ji, L. Zhang, X. Huang, J. Palmer, F. Wang, L. Tolbert, “A novel voltage balancing control with dv/dt reduction for 10-kV SiC MOSFET-based medium voltage modular multilevel converter,” IEEE Trans. Power Electron., vol. 35, no. 11, pp. 12533-12543, Nov. 2020.

18)L. Zhang, S. Ji, S. Gu, X. Huang, J. Palmer, W. Giewont, F. Wang, L. Tolbert, “Design considerations for high-voltage-insulated gate drive power supply for 10-kV SiC MOSFET applied in medium-voltage converter,” IEEE Trans. Ind. Electron., vol. 68, no. 7, pp. 5712-5724, Jul. 2021.

19)P. Yao, X. Jiang, P. Xue, S. Ji, F. Wang, “Flux balancing control of ungapped nanocrystalline core-based transformer in dual active bridge converters,” IEEE Trans. Power Electron., vol. 35, no. 11, pp. 11463-11474, Nov. 2020.

20)S. Ji, F. Wang, L. Tolbert, T. Lu, Z. Zhao, H. Yu, “An FPGA based voltage balancing control for multi HV-IGBTs in series connection,” IEEE Trans. on Ind. Appl., vol. 54, no. 5, pp. 4640-4649, Sep. 2018.

21)S. Ji, M. Laitinen, X. Huang, J. Sun, W. Giewont, F. Wang, L. Tolbert, “Short circuit characterization and protection of 10 kV SiC MOSFET,” IEEE Trans. Power Electron., vol. 34, no. 2, pp. 1755-1764, Feb. 2019.

22)B. Shi, Z. Zhao, K. Li, G. Feng, S. Ji, J. Zhou, “Design methodology for optimal phase-shift modulation of non-inverting buck-boost converter,” Journal of Power Electronics., vol. 19, no. 5, pp. 1108-1121, Sep. 2019.

23)S. Ji, S. Zheng, F. Wang, L. M. Tolbert, “Temperature-dependent characterization, modeling and switching speed limitation analysis of third generation 10 kV SiC MOSFET,” IEEE Trans. Power Electron., vol. 33, no. 5, pp. 4317-4327, May. 2018.

24)S. Ji, T. Lu, Z. Zhao, H. Yu, L. Yuan, “Series-connected HV-IGBTs using active voltage balancing control with status feedback circuit,” IEEE Trans. Power Electron., vol. 30, no. 8, pp. 4165-4174, Aug. 2015.

25)S. Ji, T. Lu, Z. Zhao, H. Yu, L. Yuan, S. Yang, C. Secrest, “Physical model analysis during transient for series connected HVIGBTs,” IEEE Trans. Power Electron., vol. 29, no. 11, pp. 5727-5737, Nov. 2014.

26)T. Lu, Z. Zhao, H. Yu, S. Ji, L. Yuan, F. He. “Parameter design of three-level converter based on series connected HV-IGBTs,” IEEE Trans. on Ind. Appl., vol. 50, no. 6, pp. 3943-3954, Nov. 2014.

27)T. Lu, Z. Zhao, S. Ji, H. Yu, L. Yuan. “Active clamping circuit with status feedback for series-connected HV-IGBTs,” IEEE Trans. on Ind. Appl., vol. 50, no. 5, pp. 3579-3590, Sep. 2014.

28)S. Ji, Z. Zhao, T. Lu, L. Yuan, H. Yu. “HVIGBT physical model analysis during transient,” IEEE Trans. Power Electron., vol. 28, no. 5, pp. 2616-2624, May. 2013.


Selected Conference Papers:

1)D. Li, X. Huang, S. Ji, C. Nie, F. Wang, L. Tolbert, “Controller design and implementation of a medium voltage (13.8 kV) modular multi-level converter for asynchronous microgrids,” IEEE Energy Conversion Congress and Exposition (ECCE), 2020, Detroit, MI.

2)X. Huang, S. Ji, D. LI, C. Nie, L. Tolbert, F. Wang, W. Giewont, “Analysis and gate driver design considerations of 10 kV SiC MOSFETs under flashover fault due to insulation failure,” IEEE Energy Conversion Congress and Exposition (ECCE), 2020, Detroit, MI.

3)X. Huang, S. Ji, D. Li, C. Nie, W. Giewont, L. Tolbert, F. Wang, “A test scheme for the comprehensive qualification of MMC submodule based on 10 kV SiC MOSFETs under high dv/dt,” European Conference on Power Electronics and Applications (EPE), 2020, Lyon, France.

4)S. Ji, J. Palmer, X. Huang, D. Li, W. Giewont, L. Tolbert, F. Wang, “Impact of submodule voltage sensor noise in 10 kV SiC MOSFET modular multilevel converters (MMCs) under high dv/dt environment,” IEEE Applied Power Electronics Conference and Exposition (APEC), 2020, New Orleans, LA, pp. 1089-1093.

5)D. Li, S. Ji, X. Huang, J. Palmer, F. Wang, L. Tolbert, “Controller development of an asynchronous microgrid power conditioning system (PCS) converter considering grid requirements,” IEEE Applied Power Electronics Conference and Exposition (APEC), 2020, New Orleans, LA, pp. 616-621.

6)J. Palmer, S. Ji, X. Huang, L. Zhang, W. Giewont, F. Wang, L. Tolbert, “Improving voltage sensor noise immunity in a high voltage and high dv/dt environment,” IEEE Applied Power Electronics Conference and Exposition (APEC), 2020, New Orleans, LA, pp. 107-113.

7)X. Huang, S. Ji, J. Palmer, L. Zhang, D. Li, F. Wang, L. Tolbert, W. Giewont, “A robust 10 kV SiC MOSFET gate driver with fast overcurrent protection demonstrated in a MMC submodule,” IEEE Applied Power Electronics Conference and Exposition (APEC), 2020, New Orleans, LA, pp. 1813-1820.

8)S. Ji, X. Huang, J. Palmer, L. Zhang, W. Giewont, F. Wang, L. Tolbert, “Medium Voltage (13.8 kV) Transformer-less Grid-Connected DC/AC Converter Design and Demonstration Using 10 kV SiC MOSFET with High Frequency,” IEEE Energy Conversion Congress and Exposition (ECCE), 2019, Baltimore, MD, pp. 1953-1959.

9)J. Palmer, S. Ji, X. Huang, L. Zhang, F. Wang, W. Giewont, L. Tolbert, “Testing and validation of 10 kV SiC MOSFET based 35 kVA MMC phase-leg for medium voltage (13.8 kV) grid,” IEEE Energy Conversion Congress and Exposition (ECCE), 2019, Baltimore, MD, pp. 2001-2006.

10)X. Huang, J. Palmer, S. Ji, L. Zhang, F. Wang, L. Tolbert, W. Giewont, “Design and testing of a modular multilevel converter submodule based on 10 kV SiC MOSFETs,” IEEE Energy Conversion Congress and Exposition (ECCE), 2019, Baltimore, MD, pp. 1926-1933.

11)L. Zhang, S. Ji, X. Huang, J. Palmer, W. Giewont, F. Wang, L. Tolbert, “Multiple-step commutation scheme for avoiding high dv/dt in modular multilevel converter with 10 kV SiC MOSFET,” IEEE Energy Conversion Congress and Exposition (ECCE), 2019, Baltimore, MD, pp. 1968-1973.

12)L. Zhang, S. Ji, S. Gu, X. Huang, J. Palmer, W. Giewont, F. Wang, L. Tolbert, “Design considerations of high-voltage-insulation gate driver power supply for 10 kV SiC MOSFET in medium-voltage application,” in IEEE Applied Power Electronics Conference and Exposition (APEC), 2019, Anaheim, CA, pp. 425-430.

13)X. Huang, S. Ji, J. Palmer, L. Zhang, L. Tolbert, F. Wang, “Parasitic capacitor’s impact on switching performance in a 10 kV SiC MOSFET based converter,” IEEE Workshop on Wide Bandgap Power Devices and Applications (WiPDA), 2018, Atlanta, GA, pp. 311-318.

14)X. Huang, S. Ji, J. Sun, S. Zheng, F. Wang, L. Tolbert, M. Laitinen, W. Giewont, “Impact of Body Diode and Anti-parallel J B S Diode on Switching Performance of 3rd Generation 10 kV SiC MOSFET,” IEEE Energy Conversion Congress and Exposition (ECCE), 2018, Portland, OR, pp. 1887-1894.

15)S. Ji, M. Laitinen, X. Huang, J. Sun, W. Giewont, L. Tolbert, F. Wang, “Short circuit characterization of 3rd generation 10 kV SiC MOSFET,” in IEEE Applied Power Electronics Conference and Exposition (APEC), San Antonio, TX, 2018.

16)S. Ji, X. Shi, Z. Zhang, W. Cao, F. Wang, “Benefits of high voltage SiC applications in medium voltage power distribution grids,” in International Conference on Silicon Carbide and Related Materials (ICSCRM), Washington, D.C., 2017.


(1) Professional Society Membership

IEEE Senior Member 

Leadership Committee member of IEEE PELS Beijing Section

Member of the Power Electronics Society

Member of the Industry Applications Society

Member of International Technology Roadmap for Wide Bandgap Semiconductors (ITRW)

Member of China Education Association of Machinery Industry


(2) Editorship in International Journals

IEEE TPEL Associate Editor

IEEE JESTPE Guest Editor

CJEE Guest Editor

CES TEMS Frontier Editor-in-chief

Engineering Reports Associate Editor

i-Energy Associate Editor


(3) Services on International Conference

IEEE Wipda-Asia 2025 Local Chair

IEEE ECCE 2025 Session Chair

IEEE ECCE 2024 Sessior Chair

IEEE ECCE-Asia 2022 Session Chair

IEEE Wipda-Asia 2021 TPC member、Session Chair